Electrically Insulating TIM T-P INS 3 A0/A1

Electrically Insulating TIM T-P INS 3 A0/A1

Electrically Insulating, Thermally Conductive

T-P INS 3 is designed for when electrical insulation is required together with high thermal performance, in this case, a Thermal Conductivity of 3.0 W/mK. This Thermal Interface Material is available with or without adhesive and like the others can be converted to any required shape.

Features and Benefits...

  • High tensile strength, designed to prevent cut-through and electrical shorts
  • Low Thermal Impedance
  • UL94-V0 recognised
  • No viscosity, 0.40mm thick
  • Adhesive option available (A1)

Applications...

  • SMPS, Telecom Devices, Visual Devices, Networking Products, LCD-TV, Notebook PC’s, PC’s, ME, Household Applications etc.
View Datasheet View Product Data

Pricing

T-P-INS-3 no adhesive 0.4mm 200x400mm

T-P-INS-3-A0-200*400

No Adhesive

1+
£87.60
5+
£83.79
10+
£77.08
25+
£71.38
50+
£64.24
100+
£53.80
Quantity Required:

T-P-INS-3 adhesive one side 0.4mm 200x400mm

T-P-INS-3-A1-200*400

Adhesive On One Side

1+
£93.89
5+
£89.81
10+
£82.64
25+
£76.51
50+
£68.86
100+
£57.68
Quantity Required:

Product Data...

Properties Test Method Unit T-P-INS 3
Material - - Thermally Conductive Silicon Cloth
Colour Visual - White
Thickness (±10%) - - 0.4
Thermal Conductivity ASTM-D5470 W/mK 3.0
Hardness (±5) ASTM-D2240 - 90
Flammability Rating UL94 - V0
Breakdown Voltage ASTM-D149 kV ≥4.0
Specific Gravity ASTM-D792 g/cm3 2.77
Working Temperature   °C -40 to 200
Volume Resistance ASTM-D257 Ohm-cm 1011
Tensile Strength ASTM-D412-1998A Mpa 1
Thermal Impedance
Pressure (psi) Thickness (mm) Compression Ration (%) Thermal Impedance (°C-in2/W)
10 0.3 6.25 0.53
25 0.3 6.25 0.4
50 0.28 12.5 0.32
100 0.27 15.6 0.28
200 0.27 15.6 0.26

Notes:

  1. Customised shapes are available
  2. The above performance data is tested in an environment of 70% humidity, temperature 25°C.
  3. This data is intended for reference purposes only. It is recommended that the material is tested to fully evaluate its performance ensuring it is fit for purpose.
  4. Use of an adhesive (A1) may affect thermal conductivity stated above

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